Electronics and Communications

Sungmee Park

Principal Research Scientist
Park

Contact Information

Office:
MRDC4504
Phone:
404-385-5541

Wenshan Cai

Associate Professor, School of Electrical and Computer Engineering
Cai

Contact Information

Office:
Pettit MiRC Bldg., Rm 213
Phone:
404-894-8911
Fax:
404-894-0560

Dr. Cai is an Associate Professor in Materials Science and Engineering, with a joint appointment in Electrical and Computer Engineering. Prior to joining Georgia Tech in January 2012, he was a postdoctoral fellow in the Geballe Laboratory for Advanced Materials at Stanford University. His scientific research is in the area of nanophotonic materials and devices, in which he has made a major impact on the evolving field of plasmonics and metamaterials.

Wenshan Cai and V. M. Shalaev, Optical Metamaterials: Fundamentals and Applications, ISBN: 978-1-4419-1150-6, Springer, New York, 2010.

S. Lan, L. Kang, D. T. Schoen, S. P. Rodrigues, Y. Cui, M. L. Brongersma, and Wenshan Cai, “Backward phase-matching for nonlinear optical generation in negative-index materials,” Nature Materials, Vol. 14, No. 8, 807-811 (2015).

L. Kang, S. Lan, Y. Cui, S. P. Rodrigues, Y. Liu, D. H. Werner, and Wenshan Cai, “An active metamaterial platform for chiral responsive optoelectronics,” Advanced Materials, Vol. 27, No. 29, 4377–4383 (2015).

S. P. Rodrigues and Wenshan Cai, “Nonlinear optics: Tuning harmonics with excitons,” Nature Nanotechnology, Vol. 10, No. 5, 387-388 (2015).

S. P. Rodrigues, Y. Cui, S. Lan, L. Kang, and Wenshan Cai, “Metamaterials enable chiral-selective enhancement of two-photon luminescence from quantum emitters,” Advanced Materials, Vol. 27, No. 6, 1124-1130 (2015).

L. Kang, Y. Cui, S. Lan, S. P. Rodrigues, M. L. Brongersma, and Wenshan Cai, “Electrifying photonic metamaterials for tunable nonlinear optics,” Nature Communications, Vol. 5, 4680 (2014).

S. P. Rodrigues, S. Lan, L. Kang, Y. Cui, and Wenshan Cai, “Nonlinear imaging and spectroscopy of chiral metamaterials,” Advanced Materials, Vol. 26, No. 35, 6157-6162 (2014).

Y. Cui, L. Kang, S. Lan, S. P. Rodrigues, and Wenshan Cai, “Giant chiral optical response from a twisted-arc metamaterial,” Nano Letters, Vol. 14, No. 2, 1021-1025 (2014).

W. Shin, Wenshan Cai, P. B. Catrysse , G. Veronis , M. L. Brongersma , and S. Fan, “Broadband sharp 90-degree bends and T-splitters in plasmonic coaxial waveguides,” Nano Letters, Vol. 13, No. 10, 4753-4758 (2013).

Wenshan Cai, “Viewpoint: Metal-coated waveguide stretches wavelengths to infinity (invited),” Physics, Vol. 6, No. 1, DOI: 10.1103/Physics.6.1 (2013).

F. Afshinmanesh, J. S. White, Wenshan Cai, and M. L. Brongersma, “Measurement of the polarization state of light using an integrated plasmonic polarimeter,” Nanophotonics, Vol. 1, No. 2, 125-129 (2012).

E. C. Garnett, Wenshan Cai, J. J. Cha, F. Mahmood, S. T. Connor, M. G. Christoforo, Y. Cui, M. D. McGehee, and M. L. Brongersma, “Self-limited plasmonic welding of silver nanowire junctions,” Nature Materials, Vol. 11, No. 3, 241-249 (2012).

Wenshan Cai, Y. C. Jun, and M. L. Brongersma, “Electrical control of plasmonic nanodevices,” SPIE Newsroom, DOI: 10.1117/2.1201112.004060 (2012).

J. S. Q. Liu, R. A. Pala, F. Afshinmanesh, Wenshan Cai, and M. L. Brongersma, “A submicron plasmonic dichroic splitter,” Nature Communications, Vol. 2, 525 (2011).

Wenshan Cai, A. P. Vasudev, and M. L. Brongersma, “Electrically controlled nonlinear generation of light with plasmonics,” Science, Vol. 333, No. 6050, 1720-1723 (2011).

Wenshan Cai and V. M. Shalaev, “Into the visible,” Physics World, Vol. 24, No. 7, 30-34 (2011).

I-K. Ding, J. Zhu, Wenshan Cai, S.-J. Moon, N. Cai, P. Wang, S. M. Zakeeruddin, M. Grätzel, M. L. Brongersma, Y. Cui, and M. D. McGehee, “Plasmonic dye-sensitized solar cells,” Advanced Energy Materials, Vol. 1, No. 1, 52-57 (2011).

Wenshan Cai, W. Shin, S. Fan, and M. L. Brongersma, “Elements for plasmonic nanocircuits with three-dimensional slot waveguides,” Advanced Materials, Vol. 22, No. 45, 5120-5124 (2010).

Wenshan Cai and M. L. Brongersma, “Plasmonics gets transformed,” Nature Nanotechnology, Vol. 5, No. 7, 485-486 (2010).

R. D. Kekatpure, E. S. Barnard, Wenshan Cai, and M. L. Brongersma, “Phase-coupled plasmon-induced transparency,” Physical Review Letters, Vol. 104, 243902 (2010).

J. A. Schuller, E. S. Barnard, Wenshan Cai, Y. C. Jun, J. S. White, and M. L. Brongersma, “Plasmonics for extreme light concentration and manipulation,” Nature Materials, Vol. 9, No. 3, 193-204 (2010).

L. Cao, P. Fan, A. P. Vasudev, J. S. White, Z. Yu, Wenshan Cai, J. A. Schuller, S. Fan, and M. L. Brongersma, “Semiconductor nanowire optical antenna solar absorbers,” Nano Letters, Vol. 10, No. 2, 439-445 (2010).

Wenshan Cai, J. S. White, M. L. Brongersma, “Compact, high-speed and power-efficient electrooptic plasmonic modulators,” Nano Letters, Vol. 9, No. 12, 4403-4411 (2009).

A. V. Kildishev, Wenshan Cai, U. K. Chettiar, and V. M. Shalaev, “Transformation optics: approaching broadband electromagnetic cloaking,” New Journal of Physics, Vol. 10, 115029 (2008).

U. K. Chettiar, S. Xiao, A. V. Kildishev, Wenshan Cai, H.-K. Yuan, V. P. Drachev, and V. M. Shalaev, “Optical metamagnetism and negative-index metamaterials,” MRS Bulletin, Vol. 33, No. 10, 921-926 (2008).

Wenshan Cai, U. K. Chettiar, A. V. Kildishev, and V. M. Shalaev, “Designs for optical cloaking with high-order transformations,” Optics Express, Vol. 16, No. 8, 5444-5452 (2008).

V. P. Drachev, U. K. Chettiar, A. V. Kildishev, H.-K. Yuan, Wenshan Cai, and V. M. Shalaev, “The Ag dielectric function in plasmonic metamaterials,” Optics Express, Vol. 16, No. 2, 1186-1195 (2008).

Wenshan Cai, U. K. Chettiar, A. V. Kildishev, V. M. Shalaev, and G. M. Milton, “Nonmagnetic cloak with minimized scattering,” Applied Physics Letters, Vol. 91, 111105 (2007).

U. K. Chettiar, A. V. Kildishev, H.-K. Yuan, Wenshan Cai, S. Xiao, V. P. Drachev, and V. M. Shalaev, “Dual-band negative index metamaterial: double-negative at 813 nm and single-negative at 772 nm,” Optics Letters, Vol. 32, No. 12, 1671-1673 (2007).

Wenshan Cai, U. K. Chettiar, A. V. Kildishev, and V. M. Shalaev, “Optical cloaking with metamaterials,” Nature Photonics, Vol. 1, No. 4, 224-227 (2007).

Wenshan Cai, U. K. Chettiar, H.-K. Yuan, V. C. de Silva, A. V. Kildishev, V. P. Drachev, and V. M. Shalaev, “Metamagnetics with rainbow colors,” Optics Express, Vol. 15, No. 6, 3333-3341 (2007).

H.-K. Yuan, U. K. Chettiar, Wenshan Cai, A. V. Kildishev, A. Boltasseva, V. P. Drachev, and V. M. Shalaev, “A negative permeability material at red light,” Optics Express, Vol. 15, No. 3, 1076-1083 (2007).

A. V. Kildishev, Wenshan Cai, U. K. Chettiar, H.-K. Yuan, A. K. Sarychev, V. P. Drachev, and V. M. Shalaev, “Negative refractive index in optics of metal-dielectric composites,” Journal of the Optical Society of America B, Vol. 23, No. 3, 423-433 (2006).

V. P. Drachev, Wenshan Cai, U. K. Chettiar, H.-K. Yuan, A. K. Sarychev, A. V. Kildishev, G. Klimeck, and V. M. Shalaev, “Experimental verification of an optical negative-index material,” Laser Physics Letters, Vol. 3, No. 1, 49-55 (2006).

Wenshan Cai, D. A. Genov and V. M. Shalaev, “Superlens based on metal-dielectric composites,” Physical Review B, Vol. 72, 193101 (2005).

V. M. Shalaev, Wenshan Cai, U. K. Chettiar, H.-K. Yuan, A. K. Sarychev, V. P. Drachev, and A. V. Kildishev, “Negative index of refraction in optical metamaterials,” Optics Letters, Vol. 30, No. 24, 3356-3358 (2005).

Rao Tummala

Pettit Chair Professor
Tummala

Contact Information

Office:
MaRC 351
Phone:
404.894.9097
Fax:
404.894.9140

Dr. Rao Tummala is a Distinguished and an Endowed Chair Professor in Electrical and Computer Engineering and in Materials Science and Engineering at Georgia Tech. He is also the Founding Director of an Engineering Research Center (ERC), originally funded by the NSF, called the Microsystems Packaging Research Center (PRC) pioneering the Second Law of Electronics (the first being Moore ’s Law) by his System-On-Package (SOP) vision.

  • Tummala, R.R., "Moving Next-Generation Electronics Beyond Moore's Law," Georgia Institute of Technology Research Horizons magazine, Faculty Column, November 2006, 
    pgs. 24-25.
  • Tummala, R.R., “Moore’s Law Meets Its Match”, IEEE Spectrum magazine, June 2006.
  • Tummala, R.R., P. Markondeya Raj, Venky Sundaram, Chong Yoon, Mahadevan Iyer, “SOP for multifunctional system packages”, Advanced Packaging, July 2005.
  • Tummala, R.R., Manos Tentzeris, Joy Laskar, Gee-Kung Chang, Suresh Sitaraman, David Keezer, Daniel Guidotti, Zhaoran Huang, Kyutae Lim, Lixi Wan, Swapan Bhattacharya, Venkatesh Sundaram, Fuhan Liu, and P. Markondeya Raj, “The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade”, IEEE Transactions on Advanced Packaging, vol. 27, no 2, pp. 250-267, 2004.
  • Tummala, R.R., editor and author, “SOP: What is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade”, IEEE Transactions on Advanced Packaging, vol. 27, no 2, pp. 241-249, 2004.
  • Tummala, R.R., “System-on-Package Integrates Multiple Tasks”, February 2004
  • Tummala, R.R., Joy Laskar, "Gigabit wireless: System-on-Package technology," Proceedings of the IEEE, Vol. 92, 2004, pp. 376–387.
  • Tummala, Venky Sundaram, Fuhan Liu, Sidharth Dalmia, Joseph Hobbs, Erdem Matoglu, Mekita Davis, George White, Joy Laskar, Madhavan Swaminthan, Nan-Marie Jokerst, Toshihisa Nonaka, "Digital, RF and Optical Integration in System-on-a-Package (SOP) for Convergent Systems", ICEP 2002, Tokyo, Japan, June 2002.
  • Tummala R. R., Editor and Author, Fundamentals of Microsystems Packaging, McGraw Hill, June 2001.
  • R. R. Tummala, V. K. Madisetti, System on Chip or System on Package, IEEE Design & Test of Computers, Vol. 16, No. 2, pp. 48-56, April 1999.
  • Tummala, R.R., co-editor and author, Microelectronics Packaging Handbook, 3 volumes, Chapman Hall, 1996.
  • Tummala, R. R., Multichip Packaging A Tutorial, Proceedings of IEEE, Vol. 80, pp. 1924-1941, Dec. 1992
  • Tummala, R.R., Ceramic and Glass-Ceramic Packaging in the 1990s, Journal of American Ceramic Society, Vol. 74, pp. 895-908, 1991.
  • Tummala, R. R., editor & author, Microelectronics Packaging Handbook, Van Nostrand, 1989.

Eric Vogel

Deputy Director of the Institute for Electronics and Nanotechnology (IEN) Associate Director for Shared Resources of the Institute for Materials (IMat)
Vogel

Contact Information

Office:
Marcus 2133
Phone:
404.385.7235
Fax:
404.894.9140

Eric M. Vogel is currently Professor of Materials Science and Engineering, Deputy Director of the Institute for Electronics and Nanotechnology, and Associate Director for Shared Resources of the Institute for Materials. Prior to joining GT in August 2011, he was Associate Professor of Materials Science and Engineering and Electrical Engineering at the University of Texas at Dallas (UTD) where he was also Associate Director of the Texas Analog Center of Excellence and led UTD’s portion of the Southwest Academy for Nanoelectronics.

Sundaresan Jayaraman

Kolon Professor
Jayaraman

Contact Information

Office:
MRDC 4411
Phone:
404.894.2461
Fax:
404.894.9140

Dr. Sundaresan Jayaraman is Kolon Professor in the School of Materials Science and Engineering with a joint appointment in the Scheller College of Business at the Georgia Institute of Technology.

Selected Publications

Park, S., Chung, K., and Jayaraman, S., “Wearables: Fundamentals, Advancements and Roadmap for the Future”, in Sazonov, E., and Neuman, M., (Eds). Wearable Sensors, Elsevier, Amsterdam, September 2014, pp. 1-23.

 Park, S., and Jayaraman, S., “The Engineering Design of Intelligent Protective Textiles and Clothing”, in Kiekens, P., and Jayaraman, S., (Eds). Intelligent Textiles and Clothing for Ballistic and NBC Protection: Technology at the Cutting Edge, NATO Science for Peace and Security Series B: Physics and Biophysics, Springer, The Netherlands, January 2012, pp. 1-27.

Sundaramoorthy, S., Nallampalayam, P., and Jayaraman, S., “Air Permeability of Multilayer Woven Fabric Systems”, Journal of the Textile Institute, Vol. 102, No. 3, pp. 189-202, March 2011.

Park, S., and Jayaraman, S., “Smart Textile-based Wearable Biomedical Systems: A Transition Plan for Research to Reality,” IEEE Transactions on Information Technology in Biomedicine, Vol. 14, No. 1, pp. 86-92, 2010.

Park, S., and Jayaraman, S., “Wearable Sensor Networks: A Framework for Harnessing Ambient Intelligence”, Journal of Ambient Intelligence and Smart Environments, Vol. 1, No. 2, 117-128, 2009.

Jayaraman, S., Kiekens, P., and Grancaric, A., Intelligent Textiles for Personal Protection and Safety, IOS Press, Amsterdam, The Netherlands, 2006.

Park, S., and Jayaraman, S., “The Wearable Motherboard: the New Class of Adaptive and Responsive Textile Structures,” in Intelligent Textiles for Personal Protection and Safety (ed. S. Jayaraman, P. Kiekens and A. Grancaric), pp. 21-39, IOS Press, Amsterdam, The Netherlands, 2006.

Park, S., and Jayaraman, S., “Sensors and Wearable Technologies for Pervasive Healthcare”, in Pervasive Computing in Healthcare (eds. Bardram, J.E., Mihailidis, A., and Wan, D.), CRC Press, November 2006.

Park, S., and Jayaraman, S., “Intelligent Textiles for Personal Protection and Safety: The Emerging Discipline,” in Intelligent Textiles for Personal Protection and Safety (ed. S. Jayaraman, P. Kiekens and A. Grancaric), pp. 5-19, IOS Press, Amsterdam, The Netherlands, 2006.

Park, S., and Jayaraman, S., “e-Health and Quality of Life: The Role of the Wearable Motherboard,” in Wearable eHealth Systems for Personalised Health Management (ed. A. Lymberis and D. DeRossi), pp. 239-252, IOS Press, Amsterdam, The Netherlands, 2004.

Park, S., and Jayaraman, S., “Smart Textiles: Wearable Electronics Systems,” MRS Bulletin, Vol. 28, No. 8, August 2003, pp. 585-591.

Park, S., and Jayaraman, S., Enhancing the Quality of Life through Technology: The Role of Personalized Wearable Intelligent Information Infrastructure,” IEEE Engineering in Medicine and Biology, Vol. 23, No. 2, May/June 2003, pp. 41-48.

Park, S., and Jayaraman, S., “Adaptive and Responsive Textile Structures,” in Smart Fibers, Fabrics and Clothing: Fundamentals and Applications (ed. X. Tao), pp. 226-245, Woodhead Publishing Limited, Cambridge, UK, 2001.

Gopalsamy, C., Park, S., Rajamanickam, R., and Jayaraman, S., “The Wearable MotherboardÔ: The First Generation of Adaptive and Responsive Textile Structures (ARTS) For Medical Applications”, Virtual Reality, 4:152-168, 1999.

 Srinivasan, K., and Jayaraman, S., "The Changing Role of Information Technology in Manufacturing", IEEE Computer, vol. 32, No. 3, 40-49, 1999.

Rajamanickam, R., Park, S., and Jayaraman, S., "A Structured Methodology for the Design and Development of Textile Structures in a Concurrent Engineering Environment", Journal of the Textile Institute, vol. 89, Part 3, 44-62, 1998.

Jayaraman, S., "Computer-Aided Design and Manufacturing: A Textile-Apparel Perspective", in Advancements and Applications of Mechatronics Design in Textile Engineering, (Acar, M., Ed.), Kluwer Academic Publishers, The Netherlands, pp. 239-269, 1995.

Narayanan, S., and Jayaraman, S., "A Knowledge-Based Decision Support System for Apparel Enterprise Evaluation", Manufacturing Decision Support Systems, (eds: Parsaei, H.R., Kolli, S.S., and Hanley, T.), pp. 67-110, Chapman and Hall, London, UK, 1994.

Narasimhan, B., Navathe, S., and Jayaraman, S., "On Mapping ER and Relational Models Into OO Schemas", Lecture Notes in Computer Science #823 Entity-Relationship Approach - ER'93, (eds: Elmasri, R.A., Kouramajian, V., and Thalheim, B.,), Springer-Verlag, Berlin, Germany, pp. 402-413, 1994.

Narayanan, S., Olson, L.H., and Jayaraman, S., "AEEF: A Knowledge-Based Framework for Apparel Enterprise Evaluation", Expert Systems With Applications Journal, Vol. 7, No. 2, pp. 337-356, 1994.

Srinivasan, K., Dastoor, P.H., Parachuru, R., and Jayaraman, S., "FDAS: A Knowledge-based Framework for the Analysis of Defects in Woven Textile Structures", Journal of the Textile Institute, vol. 83, no. 3, pp. 431-448, 1992.

Malhotra, R., and Jayaraman, S., "An Integrated Framework for Enterprise Modeling", Journal of Manufacturing Systems, vol. 11, no. 6, pp. 426-441, 1992.

Srinivasan, K., Dastoor, P.H., and Jayaraman, S., "FDAS: Architecture and Implementation", Expert Systems: The International Journal of Knowledge Engineering, Vol. 9, No. 3, pp. 115-124, 1992.

Jayaraman, S., "Design and Development of an Architecture for Computer‑Integrated Manufacturing in the Apparel Industry, Part I: Basic Concepts and Methodology Selection", Textile Research Journal, vol. 60, no. 5, pp. 247-254, 1990.

Malhotra, R., and Jayaraman, S., "Design and Development of an Architecture for Computer‑Integrated Manufacturing in the Apparel Industry, Part II: The Function Model", Textile Research Journal, vol. 60, no. 6, pp. 351-359, 1990.

Patents

Jayaraman, S., Park, S., and Rajamanickam, R., Full-fashioned Weaving Process for Production of a Woven Garment with Intelligence Capability, US Patent No: 6,145,551 Issued November 14, 2000

Jayaraman, S., Park, S., Rajamanickam, R., and Gopalsamy, C., Fabric or Garment with Integrated Flexible Information Infrastructure, US Patent No: 6,381,482, Issued April 30, 2002.

Jayaraman, S., Gopalsamy, C., Rajamanickam, R., and Park, S., Method and Apparatus for Controlling Air Bag Deployment, US Patent No: 6,254,130, Issued July 3, 2001.

Jayaraman, S., and Park, S., Full-fashioned Garment with Sleeves Having Intelligence Capability, US Patent No: 6,315,009, Issued, November 13, 2001.

Jayaraman, S., and Park, S., Garment in Fabric Having Intelligence Capability, Serial No: 09/713,160, US Patent No: 6,474,367, Issued, November 5, 2002.

Jayaraman, S., Park, S., Rajamanickam, R., and Gopalsamy, C., Fabric or Garment With Integrated Flexible Information Infrastructure For Monitoring Vital Signs of Infants, US Patent No: 6,687,523, Issued February 3, 2004.

Jayaraman, S., and Park, S., A Novel Fabric-Based Sensor for Monitoring Vital Signs, US Patent No: 6,970,731, November 29, 2005.

Jayaraman, S., and Park, S., Method and Apparatus to Create Electrical Junctions for Information Routing in Textile Structures, US Patent No: 7,299,964, November 27, 2007.