Professor C. P. Wong is the Charles Smithgall Institute Endowed Chair and Regents’ Professor. After his doctoral study, he was awarded a two-year postdoctoral fellowship with Nobel Laureate Professor Henry Taube at Stanford University.  Prior to joining Georgia Tech, he was with AT&T Bell Laboratories for many years and became an AT&T Bell Laboratories Fellow in 1992.

His research interests lie in the fields of polymeric materials, electronic packaging and interconnect, interfacial adhesions, nano-functional material syntheses and characterizations. nano-composites such as well-aligned carbon nanotubes, grahenes, lead-free alloys, flip chip  underfill, ultra high k capacitor composites and novel lotus effect coating materials.

He received many awards, among those, the AT&T Bell Labs Fellow Award in 1992, the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, the Georgia Tech Sigma Xi Faculty Best Research Paper Award in 1999, Best MS, PhD and undergraduate Thesis Awards in 2002 and  2004, respectively, the University Press (London) Award of Excellence, the IEEE Third Millennium Medal in 2000, the IEEE EAB Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002, the Georgia Tech Class of 1934 Distinguished Professor Award in 2004, Outstanding Ph.D. Thesis Advisor Award in 2005, the IEEE Components, Packaging and Manufacturing Technology Field Award in 2006, the Sigma Xi’s Monie Ferst Award  in 2007, the Society of Manufacturing Engineers (SME)’s TEEM Award in 2008, the 2009 IEEE -CPMT David Feldman Outstanding Contribution Award and the 2009 Penn State University Distinguished Alumni Award.

He holds over  50 U.S. patents, numerous international patents, has published over 1000 technical papers, 10 books and a member of the National Academy of Engineering of the USA since 2000.

Research Challenges:
Research Interests:

B.S. Chemistry, Purdue University
Ph.D. Inorganic/organic chemistry, Pennsylvania State University

  • Silicon Materials Flip-chip Devices -U.S. Patent 5,348,913 (9/20/1994) (C.P. Wong).
  • Developed a Novel Reworkable, High Temperature Adhesives(350-400C) for MCM-D (C.P. Wong, J. Wu).Substrate Attachment Applications.( US Patent 6,498,260B2(12/24/2002).
  • Reworkable Thermoset Underfills for Flip-chip Applications, (US Patent No. 6,172,141 1/9/2001 - C.P. Wong, L. Wang).
  • No Flow Flip-chip Materials the Next Generation  of High Performance Low cost Processes. (US Patent No. 6,180,696 1/30/2001 - C.P. Wong, S. Shi).
  • Method for Curing Resins - (US Patent 5,439,112. C.P. Wong).
  1. P. Zhu, X. Chu, F. Zhou, R. Sun, and C.P. Wong, “Synergistic Effect for the Preparation of LiMn2O4 Microspheres with High Electrochemical Performance” submitted.
  2. F.zhou, P.Zhu, R.Chen, R. Sun, and C.P. Wong “Comparative study of LiMnPO4 cathode materials synthesized by solvothermal methods using different manganese salts” submitted.
  3. Y. Zhang, P. Zhu, G. Li, T. Zhao, X. Fu, R. Sun, F. Zhou, and C.P. Wong, “Facile preparation of monodisperse, impurity-free and anti-oxidation copper nanoparticles in large scale for application in conductive ink.”  submitted.
  4. Y. Liu,  A. Das, Z. Lin, I. Cooper, A. Rohatgi, and C.P. Wong, “Hierarchical Robust Textured Structures for Large Scale Self-cleaning Black Silicon Solar Cells”, submitted.
  5.  T.C. Wang, L.J. Chang, G. Chen, Y. Jia, D.S. Xiong, and C.P. Wong, Preparation and hydrophobicity of biomorphic ZnO/carbon based on a lotus-leaf template, Materials Science and Engineering C, Submitted.
  6.  L.J. Chang, T.C. Wang, J. Kong, and C.P. Wong, Biomimetic fabrication of indicalamus-leaf-like structured copper surface with superhydrophobic properties, Materials Transactions, Submitted.
  7. G. Y. Zhou, C. Y. Chen, L. Y. Li, L. Z. Lin, Z. H. Tao, W. He and C. P. Wong, “Effects of Mn2+ on the Electrical Resistance of Electrolessly plated Ni-P Thin-film and its Application of Embedded Resistor inside PCB”, Journal of the electrochemical society, submitted.
  8. G. Y. Zhou, C. Y. Chen, L. Y. Li,  Z. H. Tao, W. He and C. P. Wong, “Effects of MnSO4 on Microstructure and Electrical Resistance Properties of Electroless Ni–P Thin-films and its Application in Embedded Resistor inside PCB” , circuit world, submitted.
  9.  X. Zeng, S.Yu, M.Lai, R. Sun, and C.P. Wong, “Tuning the mechanical properties of glass fiber reinforced bismaleimide-triazine resin composites by constructing flexible bridge at the interface”, submitted.
  10. S. Luo, S. Yu, R. Sun, and C.P. Wong, “Enhanced and Tailorable Dielectric Performance of Polymeric Composites with BaTiO3-supported Ag Nanoparticles as Fillers”, Submitted.
  11. Y. Lin, G. Zhang, R. Sun, and C.P. Wong, “Synthesis, characterization and cure kinetics of liquid crystalline epoxy resin containing naphthalene moiety”, submitted.
  12. Y. G. Yao, J. N. Tey, W. Jun, K. Bennett, A. Mcnamara, Y. Joshi, and C. P. Wong, “High Quality Vertically Aligned Carbon Nanotubes for Applications as Thermal Interface Materials”, IEEE Trans. on CPT, submitted.
  13. M.Wang, H.Y. Chen, W. Lin, Z. Li, Q.Li, M.H. Chen, F.C. Meng, Y.J. Xing, Y. Xuan, Y.G. Yao, C.P. Wong, and Q. W. Li. “Crack-free and Scalable Transfer of carbon nanotube arrays into flexible and highly thermal conductive composite film”, ACS Appl. Mater. Interfaces, Submitted.
  14. L. Li, Y. Liu, X. Zhao, Z. Lin, and C. P. Wong. "Uniform Vertical Trench Etching on Silicon with High-Aspect Ratio by Metal-Assisted Chemical Etching Using Novel Nanoporous Catalyst". Submitted.
  15. S. Zhao, G. Zhang, R. Sun, and C.P. Wong, “Curing kinetics, mechanism and chemorheological behavior of methanol etherified amino/novolac epoxy systems”, submitted.
  16. S. Zhao, G. Zhang, R. Sun, and C.P. Wong, “Modification and characterization of novolac epoxy resin by p-hydroxybenzoic acid and its cured polymers”, submitted.
  17. Z.Li, K.S. Moon, S. Wilkins, Y.G. Yao and C.P. Wong, “Carbon nanotubes inhibit the free radical cross-linking of siloxane polymers”, J. Appl. Polym. Sci., Submitted.
  18. O. Hildreth, B. Cola, S. Graham, and C. P. Wong "Conformally coating vertically aligned carbon nanotube arrays using
  19. thermal decomposition of iron pentacarbonyl," Journal of Vacuum Science and Technology B - Microelectronics and Nanometer Structures, Vol. 30, No. 3, pp. 03D101 1-4 (2012).
  20.  O. Hildreth, K. Rykaczewski, and C. P. Wong, "Participation of Focused Ion Beam Implanted Gallium Ions in Metal-assisted Chemical Etching of Silicon," Journal of Vacuum Science and Technology B - Microelectronics and Nanometer Structures, Vol. 30, No. 4, pp. 040603 (2012).
  21.  O. Hildreth, A. G. Fedorov, and C. P. Wong, "3D Spirals with Controlled Chirality Fabricated Using Metal-Assisted Chemical Etching of Silicon," ACS Nano, Vol. 6, No. 11, pp. 10004-10012 (2012).
  22.  O. Hildreth, K. Rykaczewski, A. Fedorov, and C. P. Wong, "A DLVO Model for Catalyst Motion in Metal-assisted Chemical Etching Based Upon Controlled Out-of-Plane Rotational Etching and Force-Displacement Measurements," Nanoscale (in press)
  23.  Y. Liu, A. Das, S. Xu, Z. Y.  Lin, C. Xu, Z. L. Wang, A. Rohatgi, and C. P. Wong, "Hybridizing ZnO Nanowires with Micropyramid Silicon Wafer as Self-cleaning High Efficiency Solar Cells",Advanced Energy Materials, Vol. 2, No. 1, pp. 47-51 (2012)
  24.  Y. Liu, W. Lin, Z. Y. Lin, Y. H. Xiu, and C. P. Wong, "A Combined Etching Process toward Robust Superhydrophobic SiC Surfaces", Nanotechnology, Vol. 23, No. 1, pp. 255703 (2012).
  25.  Y. Liu, Z. Y. Lin, W. Lin, K. S. Moon, and C. P. Wong, "Reversible Superhydrophobic-Superhydrophilic Transition of ZnO Nanorod/Epoxy Composite Films", ACS Applied Materials & Interfaces, Vol. 4, No. 8, pp 3959-3964 (2012)
  26.  Y. Liu, Z. Y. Lin, K. S. Moon, and C. P. Wong, "Superhydrophobic Nanocomposites Coating for Reliability Improvement of Microelectronics", IEEE Transactions on Components Packaging and Manufacturing Technology, accepted.
  27.  Z. Y. Lin, M. K. Song, Y. Liu, M.L. Liu, C.P. Wong, "Facile Preparation of Nitrogen-doped Graphene as a Metal-free Catalyst for Oxygen Reduction Reaction", Physical Chemistry Chemical Physics, Vol. 14, No. 1, pp. 3381-3387 (2012).
  28.  Z. Y. Lin, G. H. Wallera, Y. Liu, M. L. Liu, and C. P. Wong, "Facile Synthesis of Nitrogen-doped Graphene via Pyrolysis of Graphene oxide and Urea and its Electrocatalytic Activity toward Oxygen Reduction Reaction", Advanced Energy Materials, Vol. 2, No.7, pp. 884-888 (2012).
  29.  Z. Y. Lin, G. Waller, Y. Liu, M. Liu, C. P. Wong, "Simple preparation of nanoporous few-layer nitrogen-doped graphene for use as an efficient electrocatalyst for oxygen reduction and oxygen evolution reactions". Carbon, Vol. 53, pp. 130-136 (2012).
  30.  Z. Y. Lin, T. R. Le, J. Song, Y. G. Yao, Z. Li, K. S. Moon, M. Tentzeris, C.P. Wong, "Preparation of Water-based Carbon Nanotube Inks and Application in the Inkjet Printing of Carbon Nanotube Gas Sensors", Journal of Electronic Packaging, in press.
  31.  Z. Y. Lin, G. H. Wallera, Y. Liu, M. L. Liu, and C. P. Wong, "Nitrogen-doped Graphene Prepared by Pyrolysis of Graphene Oxide with Polypyrrole for Electrocatalysis of Oxygen Reduction Reaction", Nano Energy, in press.
  32. Y. G. Yao, Z. Y. Lin, Z. Li, X. J. Song, K. S. Moon, C. P. Wong, "Large-scale Production of Two-Dimensional Nanosheets by Combined Low-Energy Ball Milling and Sonication", Journal of Materials Chemistry, Vol. 22, pp. 13494-13499 (2012)
  33.  Y. G. Yao, C. P. Wong, "Monolayer Graphene Growth Using Additional Etching Process in Atmospheric Pressure Chemical Vapor Deposition", Carbon, Vol. 50, No. 14, pp. 5203-5209 (2012)
  34.  Y. G. Yao, L. Tolentino, Z. Z. Yang, X. J. Song, W. Zhang, Y. S. Chen, C. P. Wong, "High-concentration aqueous dispersions of MoS2", Advanced Functional Materials, in press.
  35.  Z. Li,   Y. Gao, K.-S. Moon, Y. Yao, A. Tannenbaum and C. P. Wong, "Automatic quantification of filler dispersion in polymer composites", Polymer, Vol. 53, No. 7, pp. 1570-1580 (2012).
  36.  Z. Li, S. J. Wilkins, K.-S. Moon, and C. P. Wong, "Carbonnanotube/polymer nanocomposites: improved or reduced thermal stabilities?", Materials Science Forum, Vol.722,pp. 77-86, (2012).
  37. Z. Li, R. Zhang, K. S. Moon, Y. Liu, K. Hansen, T. Le, C. P. Wong "Highly Conductive, Flexible, Polyurethane Based Adhesives for Flexible and Printed Electronics", Advanced Functional Materials (in press).
  38. Y. Gao, Z. Li, Z. Y. Lin, L. J. Zhu, A. Tannenbaum, S. Bouix, C. P. Wong, "Automated dispersion and orientation analysis for carbon nanotube reinforced polymer composites", Nanotechnology, Vol. 23, No.43, pp. 435706-435715 (2012)
  39. W. Lin, J. T. Shang, W. T. Gu, C. P. Wong, "Parametric study of intrinsic thermal transport in vertically aligned multi-walled carbon nanotubes using a laser flash technique". Carbon, Vol. 50, No. 4, pp.1591-1603 (2012).
  40. H. Ye, X. J. Wang, W. Lin, C. P. Wong and Z. M. Zhang, "Infrared absorption  coefficients of vertically aligned carbon nanotube films", Vol. 101, No. 14, pp. 141909 (2012).
  41. Y. H. Xiu, Y. Liu, B. Balu, D. W. Hess, and C. P. Wong, "Robust Superhydrophobic Surfaces Prepared with Epoxy Resin and Silica Nanoparticles", IEEE Transactions on Advanced Packaging, Vol. 2, No. 3,pp. 395-401 (2012).
  42. T. C. Wang, L. J. Chang, and C. P. Wong, "Thermal properties of carbon/epoxy resin composites based on the template of artificial sponge", Advanced Materials Research, Vol. 560-561, pp 129-133 (2012)
  43. D. J. Yuan, W. Lin, R. Guo, C. P. Wong and S. Das, "The fabrication of vertically aligned and periodically distributed carbon nanotube bundles and periodically porous carbon nanotube films through a combination of laser interference ablation and metal-catalyzed chemical vapor deposition", Nanotechnology, Vol. 23, No. 21, pp. 215303 (2012).
  44. X. Wang, Y. Ding, D. J. Yuan, J. Hong, Y. Liu, C. P. Wong and Z. L. Wang, "Reshaping the Tips of ZnO Nanowires by Pulsed Laser Irridiation", Nano Research, Vol. 5, No. 6, pp. 412 (2012). 
  45. Y. Liu, A. Das, S. Xu, Z. Y. Lin, C. Xu, Z. L. Wang, A. Rohatgi, and C. P. Wong, “Hybridizing ZnO Nanowires with Micropyramid Silicon Wafer as Self-cleaning High Efficiency Solar Cells”, Advanced Energy Materials, Vol. 2, No. 1, pp. 47-51 (2012)
  46. C. Yang, M. F. Yuen, B. Gao, Y.H. Ma, and C. P. Wong. “Investigation of a Biocompatible Polyurethane-Based Isotropically Conductive Adhesive for UHF RFID Tag Antennas”, Journal of Electronic Materials, Vol. 40, No. 1, pp. 78-84 (2011)
  47. K. Rykaczewski, O. Hildreth, C. P. Wong, A. G. Fedorov, and J. H. Scott, “Guided Three-Dimensional Catalyst Folding during Metal-Assisted Chemical Etching of Silicon”, Nano Letters, Vol. 11, No. 6, pp. 2369–2374 (2011)
  48. K. Rykaczewski, O. Hildreth, C. P. Wong, A. G. Fedorov, and J. H. Scott, “Directed 2D-to-3D Pattern Transfer Method for Controlled Fabrication of Topologically Complex 3D Features in Silicon”, Advanced Materials, Vol. 23, No. 5, pp. 659-663 (2011)
  49. Q. Z. Liang, X. X. Yao, W. Wang, Y. Liu and C. P. Wong, “A Three-Dimensional Vertically Aligned Functionalized Multilayer Graphene Architecture - An Approach for Graphene-based Thermal Interfacial Materials”, ACS Nano, Vol. 5, No. 3, pp. 2392–2401 (2011)
  50. Z. Y. Lin, Y. Liu, Y. G. Yao, O. Hildreth, Z. Li, K. S. Moon, J. Agar and C. P. Wong, “Superior Capacitance of Functionalized Graphene”, The Journal of Physical Chemistry C, Vol. 115, No. 14, pp. 7120–712 (2011)
  51. Raghavan, S.;   Klein, K.;   Yoon, S.;   Joong-Do Kim;   Kyoung-Sik Moon;   Wong, C.P.;   Sitaraman, S.K., “Methodology to Predict Substrate Warpage and Different Techniques to Achieve Substrate Warpage Targets”, IEEE Transactions on Components, Packaging and Manufacturing Technology,  Vol. 1, No. 7, pp.1064 - 1074 (2011)
  52. O. J. Hildreth, D. Brown, and C. P. Wong, “3D Out-of-Plane Rotational Etching with Pinned Catalysts in Metal-Assisted Chemical Etching of Silicon,” Advanced Functional Materials, Vol. 21, No. 6, pp. 3119-3128(2011).
  53. Z. Li, W. Lin, K.-S. Moon, S. J. Wilkins, Y. Yao, K. Watkins, L. Morato, and C. Wong, "Metal catalyst residues in carbon nanotubes decrease the thermal stability of carbon nanotube/silicone composites," Carbon, vol.49, No. 13, pp. 4138–4148 (2011)
  54. 36. R. W. Zhang, W. Lin, K. S. Moon, Q. Z. Liang, and C. P. Wong “Highly Reliable Cu-based Conductive Adhesives Using an Amine Curing Agent for In Situ Oxidation/Corrosion Protection”, IEEE Transactions on Advanced Packaging, Vol. 1, No. 1, pp. 25-32 (2011)
  55. R. W. Zhang, K. S. Moon, W. Lin, J. C. Agar, C. P. Wong, “A simple and effective way to prepare highly conductive polymer composites by in situ reduction of silver carboxylate”, Composites Science and Technology, Vol. 71, No. 4, pp. 528-534 (2011).
  56. J. T. Shang, B. Y. Chen, W. Lin, C. P. Wong, D. Zhang, C. Xu, J. W. Liu and Q. A. Huang, “Preparation of a Wafer-Level Glass Cavities by Low-Cost Chemical Foaming Process (CFP)”, Lab on a Chip, Vol. 11, pp. 1532-1540 (2011).
  57. Y. G. Yao, Z. Li, Z. Y. Lin, K. S. Moon, J. Agar, and C. P. Wong, “Controlled Growth of Multi-Layer, Few-Layer and Single-Layer Graphene on Metal Substrates”, Journal of Physical Chemistry C, Vol. 115, No.13, pp. 5232–5238 (2011)
  58. W. Lin and C. P. Wong, "Fast etching of copper in thionyl chloride/acetonitrile solutions", Corrosion Science, Vol. 53, No. 10, pp. 3055-3057 (2011). 
  59. C. Yang, H. Gu, W. Lin, M. M. F. Yuen, C. P. Wong, B. Gao, M. Xiong, “Silver Nanowires: from Scalable Synthesis to Foldable Recyclable Electronics”,   Advanced Materials, Vol. 23, pp. 3052-3056 (2011).
  60. Y. Xiu, Y. Liu, B. Balu, D. W. Hess, C. P. Wong, “Robust Superhydrophobic Surfaces Prepared with Epoxy Resin and Silica Nanoparticles”, IEEE Transactions on Advanced Packaging, in press.
  61. Z. Li,   S. J. Wilkins, K.-S. Moon, and C. Wong, "Carbon nanotube/polymer nanocomposites: improved or reduced thermal stabilities?", Materials Science Forum, accepted.
  62. W. Lin, J. T. Shang, W. T. Gu and C. P. Wong, “Parametric Study of Intrinsic Thermal Transport in Vertically Aligned Multi-Walled Carbon Nanotubes Using a Laser Flash Technique", Carbon, accepted.
  63. T. C. Wang, L.J. Chang, and C.P. Wong, “Thermal properties of carbon/epoxy resin composites based on the template of artificial sponge”, 2012 Spring World Congress on Engineering and Technology, accepted