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C. P. Wong
Regents’ Professor
Charles Smithgall Institute Endowed Chair

Georgia Institute of Technology
Materials Science and Engineering
771 Ferst Drive, N.W.
Atlanta, GA 30332-0245

Office: Love Bldg., Room 367
Phone: 404.894.8391  | 404.894.9140
email: cp.wong@mse.gatech.edu

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B.S. Chemistry, Purdue University
Ph.D. Inorganic/organic chemistry, Pennsylvania State University

Professor C. P. Wong is the Charles Smithgall Institute Endowed Chair and Regents’ Professor in the School of Materials Science and Engineering. He received his B.S. in chemistry from Purdue University, and his Ph.D. in inorganic chemistry from the Pennsylvania State University. After his doctoral study, he was awarded a two-year postdoctoral fellowship with Nobel Laureate Professor Henry Taube at Stanford University, where he conducted studies on electron transfer and reaction mechanism of metallocomplexes. He was the first person to synthesize the first known lanthanide and actinide porphyrin complexes, which represents a breakthrough in metalloporphyrin chemistry.

Prior in joining Georgia Tech in 1996, he was with AT&T Bell Labs where he was elected an AT&T Bell Labs Fellow in 1992 for his fundamental contributions to low-cost, high performance plastic packaging of semiconductors. Currently, his work is focused on nano, functional materials, advanced polymer composites, and polymers for electronic, photonic and MEMS applications.

Dr. Wong has received many distinguished awards and medals recently receiving the 2004 Georgia Tech Distinguished Faculty Award, the highest honor given by Georgia Tech, the IEEE Components, Packaging and Manufacturing and Technology Field Award in 2006, The Sigma Xi M. Ferst Award in 2007. He was elected to the National Academy of Engineering in 2000. He holds over 47 U.S. patents and numerous international patents, has published over 450 technical papers, authored and co-authored 5 textbooks and delivered 500 keynote speeches and presentations in related areas. Dr. Wong serves on the Editorial Boards of IEEE Transactions on CPMT, the Journal of Adhesion Science and Technology, the Chip Scale Review and the editor-in-chief of the John Wiley Encyclopedia of Smart Materials.

Research Interests

  • Polymers and nanoscience chemistry
  • Novel electronic materials for packing and interconnects

Selected Patents

  • Silicon Materials Flip-chip Devices -U.S. Patent 5,348,913 (9/20/1994) (C.P. Wong).
  • Developed a Novel Reworkable, High Temperature Adhesives(350-400C) for MCM-D (C.P. Wong, J. Wu).Substrate Attachment Applications.( US Patent 6,498,260B2(12/24/2002).
  • Reworkable Thermoset Underfills for Flip-chip Applications, (US Patent No. 6,172,141 1/9/2001 - C.P. Wong, L. Wang).
  • No Flow Flip-chip Materials the Next Generation  of High Performance Low cost Processes. (US Patent No. 6,180,696 1/30/2001 - C.P. Wong, S. Shi).
  • Method for Curing Resins - (US Patent 5,439,112. C.P. Wong).

Selected Publications

  1. C. P. Wong, "Polymers for Encapsulation: Materials Processes and Reliability," Chip Scale Review, Vol. 2, No. 1, 30 (1998).
  2. C. P. Wong, S. Shi, G. Jefferson, "High Performance  No Flow Underfills for Low-cost Flip -chip Application: Part I  - Materials Characterization," IEEE Trans of CPMT, Part A, Vol. 21, No. 3, 450-458 (1998).
  3. C. P. Wong, M. Vincent, S. Shi, "Fast Flow Underfill:  Flow Rate and Co-efficient of Thermal Expansion," IEEE Trans.  on CPMT, Part A, Vol. 21, No. 2, 360 (1998).
  4. C. P. Wong, I. Segelken, K. Tai, C. Wong, "Non-hermetic  Packaging of High Voltage GDX Device with Flip-chip IC," IEEE Trans. on CPMT, Part C, vol. 21, No. 1, p. 34-42 (1998).
  5. C. P. Wong, J. Wu, R. T. Pike, "Novel Reworkable High  Temperature (in excess of 350 -400ºC) Adhsives for MCM-D  Assembly," Electronic Packaging, Vol. 25, p. 135
    (1998).
  6. C. P. Wong, M. B. Vincent, S. H. Shi, "Fast-flow Underfill Encapsulate: Flow Rate and Coefficient of Thermal Expansion," IEEE Transactions on Components, Packaging and Manufacturing  Technology, Part A, Vol. 21, No. 2, p. 360 (1998)
  7. C. P. Wong, M. Vincent, S. Shi, "Fast Flow Underfill:  Flow Rate and Co-efficient of Thermal Expansion," IEEE Trans.  on CPMT, Part A, Vol. 21, No. 2, p.360 (1998).
  8. J. Wu, R. T. Pike, C. P. Wong, "Use of Compliant Adhesives in the Large Area Processing of MCM-D Substrates," IEEE  CPMT, Part C, Vol. 21, No. 4, p. 311 (1998).
  9. C. P. Wong, "Polymers for Encapsulation: Materials Processes and Reliability," Chip and Scale Review, Vol. 2, No. 1, p. 30-37 (1998).
  10. S. Shi, C. P. Wong, "Effect of the Complexed Moisture  in Metal Acetylacetonate on the Properties of the No Flow Underfills Materials," Journal of Applied Polymer Science, Vol. 73, p.103-111 (1999).
  11. C. P. Wong, L. Wang, S. Shi, "Novel High Performance No Flow and Reworkable Underfills for Flip-chip Applications', Materials Research Innovations, Vol. 2, No. 4, p.232-247 (1999).
  12. C. P. Wong, M. M. Wong, " Recent Advances in Polymeric Packages and Adhesives," IEEE Trans. on Components and Plastic Packaging of Flip-chip and Multichip Modules of Microelectronics", Vol.22, No.1, p.21-25(1999).
  13. P. Palaniappan, D. Baldwin, J. Wu, C. P. Wong, "Correlation  of Flip-chip Underfill Process Parameters and Material Properties with In-process Stress Generation," IEEE Trans. on Electronics  Packaging Manufacturing, Vol. 22, No.1, p. 53-62 (1999).
  14. R. Bollampally, C.P. Wong, "Comparative Study of Thermally Conductive Fillers for Use in Liquid Encapsulants for Electronic Packaging," IEEE Transactions on Advanced Packaging, Vol. 22, No. 1, pg. 54- 59 (1999).
  15. C. P. Wong, D. Lu, Q. Tong, "Fundamental Understudy  of Silver Flake Lubricants in Electrical Conductivity,"  Conductive Adhesives, p. 315 (1998).
  16. L. Wang, C. P. Wong, "Novel Thermally Reworkable Underfill Encapsulants for Flip-chip Applications," IEEE Transactions on Advanced, Packaging, Vol. 22, No. 1, p.46-53 (1999).
  17. L. Wang, C. P. Wong, "Syntheses and Characterizations  of Thermally Reworkable Epoxy Resins, Part I," Journal of  Polymer Science, Polymer Chemistry, Vol.37, 2991-3001(1999).
  18. L. Wang, S. Shi, C. P. Wong, "Novel High Performance No Flow and Reworkable Underfills for Flip-chip Applications," Materials Research Innovation, Vol. 2, No.4, p.232-247 (1999).
  19. D. Lu, Q. K. Tong, C. P. Wong, "A Study of Lubricants  on Silver Flakes for Microelectronic Conductive Adhesives," IEEE CPMT, Part A, Accepted for publication, in press (1999).
  20. D. Lu, C. P. Wong, "Novel Conductive Adhesives for Surface Mount Applications," submitted to Journal of Applied Polymer  Science, Vol.74, 399-406(1999).
  21. D. Lu, Q. K. Tong, C. P. Wong, "Conductivity Mechanisms  of Isotropic Conductive Adhesives ," submitted to IEEE Trans.  on CPMT, Part C.Vol.22, No.3, p.223-227 (1999).
  22. D. Lu, Q. K. Tong, C. P. Wong, "Conductivity Mechanisms  of Isotropic conductive Adhesives (ICS's)," IEEE Trans.  on Electronics Packaging Manufacturing, Vol. 22, No. 3, pg. 228-  232 (1999).

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  23. S. H. Shi, C. P. Wong, "The Effects of the Complexed Moisture in Metal Acetylacetonate on the Properties of the No-flow  Underfill Materials," Journal of Applied Polymer Science, J. of Applied Polymer Science, Vol.73, p.103-111(1999).
  24. L. Wang, C. P. Wong, "Syntheses and Characterizations  of Thermally Reworkable Epoxy Resins. Part 1", J. of Polymer Science, Part A: Polymer Chemistry, p.2991-3001 (1999).
  25. L. Wang, S. Shi, C. P. Wong, "Novel High Performance No Flow and Reworkable Underfills for Flip-chip Applications," Materials Research Innovation, Vol. 2, No.4, p.232-247 (1999).
  26. C.P. Wong, R. S. Bollampally, "Thermal Conductivity, Elastic Modulus, and Coefficient of Thermal Expansion of Polymer Composites Filled with Ceramic Particles for Electronic Packaging,"  Journal of Applied Polymer Science, Vol. 74, pg. 3396- 3403 (1999).
  27. N. Urasaki, C.P. Wong, "Separation of Low Molecular  Siloxanes for Electronic Application by Liquid- Liquid Extraction,"  IEEE Transactions on Electronics Packaging Manufacturing, Vol.  22, No. 4, pg. 295-298 (1999).
  28. N. Rounds, C.P. Wong, "Encapsulation Materials and Processes," John Wiley Encyclopedia on Electrical and Electronic Engineering,  pg. 92- 103 (1999).
  29. C. P. Wong, J. Wu, R. T. Pike, "Characterization of  Reworkable High Temperature Adhesives for MCM-D Application,"  Journal of Applied Polymer Science, p. 290-295 (1999).
  30. J. Wu, R. T. Pike, C. P. Wong, "Novel Bi-layer Conformal Coatings for MEMS Encapsulation/Parylene-C Coated Silicone Elastomers,"  IEEE Trans. on Electronic Packaging, Vol. 22, No. 3, p.195-201 (1999).
  31. D. Lu, C. P. Wong," Characterization of Silver Flake Lubricants", Journal of Thermal Analysis and Calorimetry, Vol. 59, p.729-740(2000).
  32. S. Luo, C.P. Wong, “Study on Effect of Carbon Black on Behavior of Conductive Polymer Composites with Positive Temerature Coefficient,” IEEE Transactions on Components and Packaging Technologies, Vol. 22, No. 1, pg 151-156 (2000).
  33. J. Wu, R. Pike, S.K. Sitaraman, C.P. Wong , “New Reworkable Temperature Low Modules (in Excess of 400-500 ° C) Adhesives for MCM-D Assembly,” Journal of Electronic Packaging, Vol. 122, pg. 55-59 (2000).
  34. Y.Rao, S. Shi, C.P. Wong, ”An Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants”, IEEE Transactions on Components and Packaging Technologies, Vol.23, No. 3, p.434-439 (2000).
  35. J. Wu, R. T. Pike, C. P. Wong, M. Tanielian, N. Kim, “Evaluation and Characterization of Reliable Non-Hermetic Coformal Coating for Microelectromechanical (MEMS) Device Encapsulation,” IEEE Trans. on Advanced Packaging, Vol. 23, No. 4, 375-381(2000).
  36. D. Lu, D. Wong, C.P. Wong, “Properties of Conductive Adhesives Based on Different Curing Agents,” Journal of Electronics Manufacturing, Vol. 9, No. 4, 241-248 (2000).
  37. D. Lu, C.P. Wong, “Development of Conductive Adhesives for Solder Replacement,” IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 4, p. 620-626 (2000).
  38. D. Lu, C.P. Wong, “A Study of Contact Resistance of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems,” IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3, p. 440-446 (2000).
  39. C.P. Wong, S. Luo, Z. Zhang, “Flip the Chip,” Science, Vol. 290, p. 2269 (2000).
  40. C.P. Wong, S. Luo, “Study on Effect of Coupling Agents on Underfill Material in Flip Chip Packaging,” IEEE Trans. on Components and Packaging Technologies, Vol 24, No. 1, p. 38-42(2001).
  41. C.P. Wong, S. Luo, “Effect of UV/Ozone Treatment on Surface Tension and Adhesion in Electronic Packaging,” IEEE Trans. on Components and Packaging Technologies, Vol 24, No. 1, p. 43-49(2001).
  42. C.P. Wong, Z.Q. Zhang, S.H. Shi, “Development of No-Flow Underfill Materials for Lead-Free Solder Bumped Flip-Chip Applications,” IEEE Trans. on Components and Packaging Technologies, Vol 24, No. 1, p. 59-66(2001).
  43. L. Wang, C.P. Wong, "Study of Additive-Epoxy Interaction of Thermally Reworkable Underfills," Journal of Applied Polymer Science, Vol. 81, 1868-1880(2001).
  44. Y. Shimada, D. Lu, C. P. Wong, "Electrical Characterizations of Isotropic Conductive Adhesives (ICAs)," Journal of Electronic Manufacturing, Vol. 10, No. 2, 97-103(2001)
  45. L. Martin, C. P. Wong," Chemical and Mechanical Adhesion Mechanisms of Sputter -Deposited Metal on Epoxy Dielectric for High Density Interconnect Printed Circuit Boards," IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 3, 416-424(2001)
  46. L. Wang, H. Li, and C. P. Wong, Reworkable No-Flow Underfills for Flip Chip Applications, IEEE Transactions on Electronics Packaging Manufacturing, April 2001, Volume 24 Number 2, pp115-122 (2001).
  47. L. Fan, C. P. Wong, "Adhesion Evaluation on Low-Cost Alternatives to Thermosetting Epoxy Encapsulants
  48. L. Fan, C. P. Wong, "Development of Reworkable Underfill from Hybrid Composite of Free Radical Polymerization System and Epoxy Resin", IEEE Transactions on Components and Packaging Technologies, accepted, 2001
  49. Rajiv Carl Dunne, Suresh K. Sitaraman, Shijian Luo, C. P. Wong, William E. Estes, Mookkan Periyasamy, Johan Coburn, "Thermal and Mechanical Characterization of ViaLuxTM 81: A Novel Epoxy Photo-Dielectric Dry film (PDDF) for Microvia Applications", IEEE Transactions on Components and Packaging Technologies, Vol 24, No.3, p.436(2001).
  50. Shijian Luo and C. P. Wong, "Effect of UV/Ozone Treatment on Surface Tension and Adhesion in Electronic Packaging", IEEE Transactions on Components and Packaging Technologies, Vol 24, No.1, March 2001, p.43, (2001)
  51. Shijian Luo and C. P. Wong, "Study on Effect of Coupling Agents on Underfill Material in Flip Chip Packaging", IEEE Transactions on Components and Packaging Technologies, Vol 24, No.1, March 2001, p.38(2001).
  52. Z. Zhang, S.H. Shi, C.P. Wong, "Development of No-Flow Underfill Materials for Lead-Free Bumped Flip-Chip Applications", IEEE Trans. on Components, and Packaging Technologies, Vol. 24 (1), pp. 59-66, (2001).
  53. Y. Rao, S. Ogitani, P. Kohl, C. P. Wong, "Novel polymer-ceramic Nanocomposite Based on High Dielectric Constant Epoxy Formula for Embedded Capacitor Application," J. Applied Polymer Science, Vol. 83, p.1084-1090(2002)
  54. Y. Rao, J. Yue, C. P. Wong,"Materials characterizations of High Dielectric Constant Polymer -ceramic Composite for Embedded Capacitor for RF Application", Active and Passive Elec. Comp., Vol. 25, p123-129(2002).
  55. J. Qu, C.P. Wong, "Effective Elastic Modulus of Underfill Material for Flip chip Applications", IEEE Trans. on Components and Packaging Technologies, Vol. 25, No. 1, p.53-55(2002).
  56. Fan, Christopher K. Tison and C. P. Wong, "Study on Underfill/Solder Adhesion in Flip-Chip Encapsulation", IEEE Transactions on Advanced Packaging, Vol. 25, No.4,Pp.473-480,(2002).
  57. Y.Rao, C.P.Wong, "Novel Polymer-ceramic Nano-composite Based on High Dielectric Constant Epoxy Formula for Embedded Capacitor Application",J. Applied Polymer Science, n83,1084-1090,(2002)
  58. Fan, .K. Moon and C. P. Wong, "Adhesion of Underfill and Components in Flip Chip Encapsulation", Journal of Adhesion Science and Technology, Vol. 16, No. 2, p.213-223,(2002.)
  59. L. Fan and C. P. Wong, "Development of Reworkable Underfill from Hybrid Composite of Free Radical Polymerization System and Epoxy Resin", IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 1, Pp. 148-155, (2002).
  60. S. Luo, T. Yamashita, C. P. Wong, " Study on Property of Underfill Based on Epoxy Cured with Acid Anhydride for Flip Chip Application",  J. Electronics Manufacturing, Vol. 10, No.3, p.191-200(2002).
  61. Z. Zhang, L. Fan, C.P. Wong, "Development of Environmental Friendly Non-Anhydride No -Flow Underfills", IEEE Trans. on Components, and Packaging Technologies, Vol. 25, No.1, pp. 140-147, (2002).
  62. Z. Zhang, L. Fan, C.P. Wong, " Development of Reworkable Underfill from Hybrid Composite of Free radical Polymerization System and Epoxy Resin", IEEE Trans. on Components and Packaging Technologies, Vol. 25, No. 1, p.148-155(2002).
  63. L. Fan, C.P. Wong," Development of Environment Friendly Non-anhydride No Flow Underfills", IEEE Trans. on Compnents and Packaging Technologies, Vol. 25, No. 1, p.140-147(2002).

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  64. H. Li, L. Wang, K. Jacob and C. P. Wong, "Syntheses and characterizations of Thermally Degradable Epoxy Resins Part III", Journal of Polymer Science, Part A., Volume 40, Number 11, pp 1796-1807(2002).
  65. L. Fan, K. S. Moon and C.  P. Wong, "Adhesion of Underfill and Components in Flip Chip Encapsulation", J. Adhesion Sci. Technol., Vol. 16, No. 2, pp.213-223 (2002).
  66. J. Wu, S. Bhattacharya, M. Wong, C. Lloyd, C. P. Wong, H. B. Pogge, R. Tummala, "Development of High- Performance Filling Encapsulants for System Chips Technology,"  IEEE Trans. on Components and Packaging Technologies, Vol. 25, No. 2, 217-216(2002)
  67. Z. Zhang, C.P. Wong, "Study on the Catalytic Behavior of Metal Acetylacetonates for Epoxy Curing Reactions", Journal of Applied Polymer Science, Vol. 86, pp. 1572-1579, (2002).
  68. J. Wu, C. P. Wong, "Development of New Low Stress Epoxies for MEMS Device Encapsulation," IEEE Trans. on Components and Packaging Technologies, Vol25, No. 2, 278-282(2002).
  69. Z. Zhang, C. P. Wong, "Assembly of Lead-free Bumped Flip-chip with No Flow Underfills", IEEE Trans. On Electronic Packaging Manufacturing, Vol. 25, N0. 2, 113-119(2002)
  70. Z. Zhang, E. Beatty, C.P. Wong, “Study on the Curing Process and the Gelation of Epoxy/Anhydride System for No-Flow Underfill for Flip-Chip Applications”, Macromolecular Materials and Engineering, Vol. 288, pp. 365-371, (2003).
  71. Z. Zhang, J. Lu, and C.P. Wong, “Assembly of  Lead Free Bumped Flip-chip  No-flow Underfills,” IEEE Trans. on CPMT. Vol.26, No. 1, p.239-244(2003)
  72. H. Li, A.  Johnson, and C.P. Wong, "Development of New No-Flow
  73. Underfill Materials for Both Eutectic Solder and a High Temperature MeltingLead-Free Solder", IEEE Transactions on Electronics Packaging Manufacturing, Vol.26, No. 2, p.466-472(2003).

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  74.  K.S. Moon, L. Fan, and C.P. Wong “Enhancement of antifillet cracking performance for no -flow underfill by toughening method”,Journal of Applied Polymer Science, 88 (10), 2439-2449 (2003).
  75. K.S. Moon, J. Wu and C.P. Wong, “Improved stability of contact resistance of low melting point alloy incorporated isotropically conductive adhesives”, IEEE Transactions on Components and Packaging Technologies, 26(2), 375-381 (2003).
  76. K. Moon, C. Rockett, C. Kretz and W. F. Burgoyne and C.P. Wong, Improvement of Adhesion and Electrical Properties of Reworkable Thermoplastic Conductive Adhesives, Journal of Adhesion Science & Technology, 17(13), 1785 (2003).
  77. H. Li, K. Jacob, C. P. Wong, “An Improvement of Thermal Conductivity of Underfill Materials for Flip-chip Packages”, IEEE Trans. on Advanced Packaging Vol. 26, No. 1, p.25-32(2003)
  78. Z. Zhang, J. Lu, C.P. Wong, “Double-Layer No-Flow Underfill Process for Flip-Chip Applications”, IEEE Trans. on Components, and Packaging Technologies, Vol.25, No. 1, pp. 239-244, March( 2003).
  79. Y. Rao, A. Takahashi, C. P. Wong, “Di-block copolymer surfactant study to optimize filler dispersion in high dielectric constant polymer-ceramic composite”, Composites, Part A: Applied Science and Manufacturing, 34A(11), 1113-1116 (2003).
  80. Z. Zhang, E. Beatty, C.P. Wong, “Study on the Curing Process and the Gelation of Epoxy/Anhydride System for No-Flow Underfill for Flip-Chip Applications”, Macromolecular Materials and Engineering, Vol. 288, pp. 365-371, (2003).
  81. Z. Zhang, C.P. Wong, “Double Layer No-Flow Underfill Materials and Process”, IEEE Transactions on Advanced Packaging, Vol. 16, No. 2, pp. 199-205,( 2003).
  82. Lianhua Fan and C. P. Wong, “Adhesion Evaluation on Low-Cost Alternatives to Thermosetting Epoxy Encapsulants”, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No. 2, Pp. 173-178 (2003).
  83. Kyoung-Sik Moon, Lianhua Fan and C. P. Wong, “Enhancement of Anti-fillet Cracking Performance for No-Flow Underfill by Toughening Method”, Journal of Applied Polymer Science, Vol. 88, No. 10, Pp. 2439-2449 (2003).
  84. S. Luo, C. P. Wong,” Surface Property of Passivation Layer on IC Chip and Solder Mask Layer on Printed Circuit Board”, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No.4, p.345-351(2003).
  85. K. Moon, C. Rockett, C. Kretz, W. F. Burgoyne, and C.P. Wong, “Improvement of Adhesion and Electrical properties of Reworkable Thermoplastic Conductive Adhesives”,Journal of Adhesion Science & Technology, Vol.17, No. 13, p.1785-1800(2003)
  86. H. Li, K. Moon, C. P. Wong,” A Novel Approach to Stabilize Contact Resiostance of Electrically Conductive Adhesives on Lead- free Alloy Surfaces”, Journal of Electronic Materials, Vol. 33, No.2, 22-33(2004)
  87. K.S. Moon, C. Rockett, C. P. Wong, “Adhesion Improvement of Thermoplastic-based Isotropic Conductive Adhesives Under Humid Environment Using Self-Assembly Monolayer Compounds”, J. of Adhesion Science and Technology, Vol. 18, No. 2., p.135-168(2004)
  88. H. Li, K.S. Moon and C.P. Wong, “A Novel Approach to Stabilize Contact Resistance of Electrically”, Conductive Adhesives on Lead-Free Alloy Surfaces”, Journal of Electronic Materials, Vol. 33, No. 2, p.106-111(2004)
  89. L. Fan and C. P. Wong, “Adhesion Evaluation on Low-Cost Alternatives to Thermosetting Epoxy Encapsulants”, IEEE Transactions on Electronic Packaging Manufacturing, Vol.26, No. 2, 173-178(2004)
  90. S. Luo, C. P. Wong, ”Moisture Absorption on Uncured Underfill materials”, IEEE Trans. on Components, and Packaging Technologies, Vol. 27, No. 2, p. 345-351(2004)
  91. H. Noh, K. Moon, A. Cannon, P. Hesketh, C. P. Wong ,”Wafer Bonding using Microwave Heating of Parylene Intermediate Layers”, J. Micromechanical Microengineering, Vol. 14, p.625-631(2004)
  92. Z. Zhang, C. P. Wong, “ Double Layer No Flow Underfill Materials and Process,” IEEE Trans. on Advanced Packaging, Vol. 26, No.2, p.199-205(2004)
  93. R. Pucha, S. Sitaraman,,C.P. Wong, Z. Zhang, P. Raj, R. Tummala,” Materials and Mechanics Challenge in SOP-based Convergent Microsystems”, Micro-Materials and Nano -Materials, Vol.3, p.16-29(2004)
  94. Zhuqing Zhang, Y.  Sun, Lianhua Fan and C. P. Wong, “Study on B-Stage Properties of Wafer Level Underfill”, Journal of Adhesion Science and Technology, Vol.18, No. 3, p.361-380(2004)
  95. H. Li , C. P. Wong, ”A Reworkable Epoxy Resin for Isotropically Conductive Adhesive”,  IEEE Trans. on Advanced packaging, Vol. 27, No. 1, p. 165-172(2004)
  96. S. Luo, C. P. Wong,”Adhesion between an Underfill and the Passivation Layer in Flip-Chip Packaging”, J. Adhesion Sci. and Technol., Vol. 18, No. 1, 1-11(2004)
  97. Z. Zhang, S. K. Sitaraman, C.P. Wong, “ FEM Modeling of  Temperasture Distribution of Flip -chip No-Flow Underfill Packaging During Solder Reflow process”, IEEE Transactions on Electronic Manufacturing, Vol.27, No. 1, p.86-98(2004).
  98. R, Yao, D. Lu, C. P. Wong, “A Study on Impact Performance of Conductive Adhesives,” Journal of Applied Polymer Science, Vol. 24, No. 5, p.449-453(2004).
  99. Z. Zhang, C.P. Wong, “Modeling of the Curing Kinetics of No-Flow Underfill in Flip-Chip Applications”, IEEE Transactions on Components and Packaging Technologies, Vol.27, No. 2, p.383-390(2004).
  100. K.S. Moon, S. Liong, H. Li and C.P. Wong, “Stabilizing Contact Resistance of Isotropically Conductive Adhesives (ICA) on Various Metal Surfaces by Incorporating Sacrificial Anode Materials”, Journal of Electronic Materials, Vol. 33, No. 4, p.1381-1388(2004)
  101. A. A. Toy,,..C. P. Wong,..”Next Generation of 100um Pitch Wafer-Level Packaging and Assembly for System-on-Packaging”, IEEE Trans. on Advanced Packaging, Vol.27, No. 2, p. 413-425(2004)
  102. Z. Zhang, C.P. Wong, “Recent Advances in Flip-Chip Underfill: Materials, Process and Reliability”, IEEE Transactions on Advanced Packaging, Vol.27, No. 3, p. 515-524(2004)
  103. Z. Zhang, H. Li, C.P. Wong, “Novel Reworkable Fluxing Underfill for Board Level Assembly”, IEEE Transactions on Advanced Packaging ”, IEEE Trans. on Advanced Packaging, Vol.27, No. 3, p. 525-532(2004)
  104. Hai Dong, K. Moon, C. P. Wong, “Molecular Dynamics Study on Coalescence of Cu Nanoparticles and Their Deposition on Cu Substrate”, Journal of Electronic Materials, Nov. p. 1326-1330 (2004).
  105. S. Y. Y. Leung, D. D. Lam, S. Luo, C. P. Wong, “The Role of water in Delamination in Electronic Packaging: Degradation of Adhesion”, J. of Adhesion Science and Technology, Vol. 18, No. 10, p.1103-1122(2004)
  106. Y. Sun, L. Fan, K. Watkins, J. Peak, and C. Wong, "An Electrical Approach to Monitor Wire and Cable Thermal Oxidation Aging Condition Based on Carbon Black Filled Conductive Polymer Composite," JOURNAL OF APPLIED POLYMER SCIENCE, Vol. 93, pp. 513-520, (2004).
  107. Y. Fujiyasi, C.E.Pierce, L. Fan, C. P. Wong,” High Dielectric Insulating Coating for Time Domain Reflectivity Soil Moisture Sensor”, Water Resource Research, Vol. 4, No. 4, p.276-281(2004).
  108. Y. Sun, S. Luo, K. Watkins, and C. Wong, "Electrical Approach to Monitor the Thermal Oxidation Aging of Carbon Black Filled Ethylene Propylene Rubber,"POLYMER DEGRADATION AND STABILITY, Vol. 86, pp. 209-215, (2004)
  109. Yangyang Sun, Zhuqing Zhang, Kyoung-sik Moon and C.P. Wong, “Glass Transition and Relaxation Behavior of Epoxy Nano-composites”, J. of Polymer Science : Part B: Polymer Physics, Vol. 42. p.3849-3858(2004)
  110. Y. Sun, Z. Zhang, and C. Wong, "Development of a High Curing Latency No-Flow Underfill with Self-Fluxing Ability for Lead-Free Solder Interconnects," JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, Vol. 18,  No. 2, pp. 109-121, (2004).
  111. Z. Zhang, Y. Sun, L. Fan, and C. Wong, "Study on B-Stage Properties of Wafer Level Underfills," JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, Vol. 18, No. 3, pp. 361-380,( 2004).
  112. J. Xu, C. P. Wong,” Effect of the Polymer Matrices on the Dielectric Behavior of a Percolative High K Polymer Composite for Embedded Capacitor Applications”, J. of Electronic Materials, Vol. 35, No. 5, p.1087-1095(2006)
  113. Erik Sunden, Jack K. Moon, C. P. Wong, William P. King and Samuel Grahama, "Microwave assisted patterning of vertically aligned carbon nanotubes onto polymer substrates", J. Vac. Sci. Technol. B 24(4), 1947(2006)
  114. Y. Li, K. Moon, C. P. Wong, ”Novel Curing Agent for Lead-free Electronics : Amino Acid’, J. Polymer Science, Polymer Chemistry, vol. 44, p.1020-1027(2006).
  115. L. Zhu, Jianwen Xu, Yonghao Xiu, Yangyang Sun, Dennis W. Hess, and C. P. Wong, “Electrowetting of Aligned Carbon Nanotube Films”, Journal of Physical Chemistry – B, 110(32), 15945-15950, 2006.
  116. L. Zhu, Dennis W. Hess, and C. P. Wong, “Monitoring Carbon Nanotube Growth by Formation of Nanotube Stacks and Investigation of the Diffusion-Controlled Kinetics”, Journal of Physical Chemistry – B, 110(11), 5445-5449, 2006.
  117. L. Zhu, Yangyang Sun, Dennis W. Hess, and C. P. Wong, “Well-Aligned Open-Ended Carbon Nanotube Architectures: an Approach for Device Assembly”, Nano Letters, 6(2), 243-247, 2006.

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  118.  L. Zhu, J. Xu, Y. Xiu, Y. Sun, D. W. Hess, and C. P. Wong, "Controlled Growth and Electrical  Characterization of High-aspect ratio Carbon Nanotube Arrays", Carbon, Vol. 44, No. 2, p. 253-258 (2006).
  119. Y. Li, C. P. Wong,”Monolayer Protection for Electrochemical Migration Control in Silver nanocomposite”, Applied Physics Letters, Vol.89, p.112112-112115(2006)
  120. H. Dong, Z. Zhang, C. P. Wong, “Molecular Dynamics Study of a Nano-particle Joint for Potential Lead-free Anisotropic Conductive Adhesives Applications”, J. Adhesion Science & Technology, Vol. 19, No. 2, p.87-94(2006).
  121. Y. Sun, Z. Zhang, and C. P. Wong, "Study and characterization on the nanocomposite  underfill for flip chip applications," IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 1, p. 190-197, 2006.
  122. Yi Li, K. S. Moon and C.P. Wong “Electrical Property Improvement of Electrically Conductive Adhesives through in- situ Replacement by Short-Chain Difunctional Acids”, IEEE Transactions on Components and Packaging Technologies, Vol. 29, N0. 1, p.173-1179(2006)
  123. L. Zhu, J. Xu, Y. Xiu, D. Hess, and C. P. Wong, "A Rapid Growth of Aligned Carbon Nanotube Films and High-Aspect-Ratio Arrays," Journal of Electronic Materials, Vol. 35, No. 2, p.195-201(2006).
  124. Y. Li, C.P. Wong,” High Performance Anisotropic Conductive Adhesives for Lead-free Interconnects”, Soldering & Surface Mount Technology, Vo. 18, No. 2, p.33-39(2006)
  125. Y. Li, K. Moon, and C. P. Wong, “Enhancement of Electrical Properties of Anisotropically Conductive Adhesive (ACA) Joints via Low Temperature Sintering”, Journal of Applied Polymer Science, Vol. 99 (4), p. 1665-1673 (2006).
  126. E. Sunden, K. Moon, C.P. Wong, W. P. King, S. Graham, “Microwave –assisted Patterning of Vertically Aligned Carbon Nanotube onto Polymer Substrates”, Journal of Vacuum Science & Technology B: Microelectronic and  Nanometer Structures, Vol.24, Issue 4, p.1947-1950(2006).
  127. Yi Li and C. P. Wong, “Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications”, Materials Science and Engineering R, Vol. 51, p.1-35(2006).
  128. J. Xu, K. Moon, C. Tison, C. P. Wong,” A Novel Aluminum- filled Composite Dielectric for Embedded Passive Applications”, IEEE Trans. on Advanced Packaging, Vol. 29, No. 2, p.295-306(2006).
  129. H. Jiang, K. Moon, Z. Zhang, S. Pothukuchi, C. P.  Wong, “Variable Frequency Microwave Synthesis of Silver Nanoparticles”, Journal of Nanoparticle Research, Vol.8, p.117-124 (2006).
  130. H. Jiang, K. Moon, Z. Zhang, S. Pothukuchi and C. P. Wong, “Variable Frequency Microwave Synthesis of Silver Nanoparticles”, Journal of Nanoparticle Research, , Vol. 8, 117(2006).
  131. H. Jiang, K. Moon, Y. Li and C. P. Wong, “Surface Functionalized Silver Nanoparticles for Ultra-Highly Conductive Polymer Composites”, Chemistry of Materials, Vol. 18, p.2969
    (2006).
  132. H. Jiang, K. Moon, H. Dong, F. Hua and C. P. Wong, “Size-dependent melting properties of tin nanoparticles”, Chemical Physics Letters, Vol. 429, p.492,( 2006).
  133. Y. Xiu, L. Zhu, D. W. Hess, C. P. Wong, "Biomimetic Creation of Hierarchical Surface Structures by Combining Colloidal Self-Assembly and Au Sputter Deposition" Langmuir,
    Vol.22(23): p. 9676-9681 (2006).
  134. Y. Li, K.S. Moon, C.P. Wong, "Enhancement of Electrical Property of Anisotropically  Conductive Adhesives (ACAs) Joints via Low Temperature Sintering", Journal of Applied Polymer Science, Vol. 99, p.1665-1673(2006)

Materials for Electronic Packaging and Assembly

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